Nordson YESTECH is a leading provider of AOI and X-Ray inspection systems, with integrated Yield Enhancement Solutions for electronic manufacturers.

Our high-speed FX Series and BX Benchtop AOI systems are configurable with 5 megapixel color camera imaging technology. With one top-down and 4 side-viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

The new X3 X-Ray system’s proprietary technology provides unsurpassed 3D inspection capability for BGA’s and other hidden solder joints on double-sided PCBs.

Nordson YESTECH’s advanced SPC software is available with all systems, providing real-time yield information.