Rehm Thermal Systems - your ONE source for convection AND condensation (vapor phase) soldering systems. Rehm offers a complete line of thermal systems for PCB assembly applications including curing, convection reflow, and vapor phase reflow soldering. VXP high performance convection reflow ovens feature exclusive Pyrolisis flux management system for optimal process control and maintenance intervals up to 1 year! VXS convection reflow ovens offer an excellent cost/performance ratio for moderate-high volume production needs. For condensation (vapor phase)  soldering, our CONDENSO systems utilize a patented injection principle which provides superior process control for more challenging soldering applications. The CONDENSO XP-HS system provides an automated in-line handling system for higher volume applications. Available vacuum soldering and plasma cleaning options provide the highest quality soldering process for critical applications. Rehm also offers a complete line of drying and fast-firing systems  for PV (solar cell) fabrication. Please visit www.rehm-group.com for more information.