Alltemated sets the standard for tape and reel packaging services, IC programming services, lead forming/trimming and SMT carrier tape manufacturing.  Since 1993, Alltemated has been the electronics industry's preferred choice for one-stop component-preparation services.  Alltemated has introduced PLACE-N-BONDTM pre-form adhesives. This Patented Partial Underfilm Technology uses thin solid thermoplastic films to edge or corner bond BGA/CSP packages to the PCB to improve solder Ball/Joint reliability. This is accomplished by pick and placing the films onto the PCB prior to placement of the BGA/CSP.  The pre-form films are supplied in standard EIA-481 carrier tapes.  Utilizing existing feeders on existing SMT assembly lines, the films are placed during component placement.